Method of forming a pressure-contact type semiconductor device

Details Method of forming a pressure-contact type semiconductor device Method of forming a pressure-contact type semiconductor device

H - Electricity

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356/150

H01L 21/48 (2006.01) H01L 23/049 (2006.01) H01L 23/48 (2006.01)

Patent

CA 1239229

ABSTRACT OF THE DISCLOSURE The present invention relates to a method of manufac- turing a semi-conductor device by providing a projection formed by pressing the side wall portion of a metal cylindrical body from the outside toward the Inside of the cylindrical body and engaging an outer peripheral edge of the upper surface of the cylindrical elastic member contained In the cylindrical body with the projection.

489870

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