H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/8
H05K 3/30 (2006.01) B23K 35/34 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2030865
Abstract of the Disclosure A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a citcuit board. Then, the paste-like compo- sition is heated so as to cause precipitation, thereby forming a solder layer formed of an Sn-Pb alloy substan- tially only on pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquified by heating, and the tin powder is settled in the liquid pool. When an electronic part is to be mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on the prepar- atory solder layers, the electronic part is put on the paste-like composition. Then, the paste-liks composi- tion is heated, thereby soldering leads of the elec- tronic part with the pads.
Fukunaga Takao
Fuse Kenichi
Irie Hisao
Kohno Masanao
Harima Chemicals Inc.
Ridout & Maybee Llp
The Furukawa Electric Co. Ltd.
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