H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/09 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2055148
A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the marginal edges of the contact area. A thin layer of soldermask is then applied to cover the upper surface of the copper buss outside of the contact area. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the copper buss in the contact area defined on the substrate and over a small portion of the soldermask so that the copper buss is covered completely.
Auger Benoit
Casavant Charles
Erat Wolfgang
Langevin Alain
Blake Cassels & Graydon Llp
Circo Craft Co. Inc.
Viasystems Canada G.p.
LandOfFree
Method of forming an electrically conductive contact on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming an electrically conductive contact on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming an electrically conductive contact on a... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1702603