Method of forming an insulator on a patterned conductive layer

Details Method of forming an insulator on a patterned conductive layer Method of forming an insulator on a patterned conductive layer

H - Electricity

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356/165

H01L 21/465 (2006.01) H01L 21/3105 (2006.01) H01L 21/311 (2006.01)

Patent

CA 1229180

12 ABSTRACT: "Method of forming an insulator on a patterned conductive layer." A structure having a substantial planar surface is created by a method in which an insulating layer (24) that has an upward protrusion (26) is formed on a patterned conductive layer (20) having a corresponding upward pro- trusion (22). An additional layer (28) having a substan- tially planar surface is formed on the insulating layer. Using an etchant that attacks the additional layer much more than the insulating layer, the additional layer is etched to expose at least part of the insulating protrusion. The additional layer and the insulating layer (as it be- comes exposed) are then etched with an etchant that attacks both of them at substantially the same rate. This brings the upper surface down without exposing the conductive layer, particularly its upward protrusion.

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