Method of forming chromium coated copper for printed circuit...

C - Chemistry – Metallurgy – 23 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C23C 14/02 (2006.01) C23C 28/00 (2006.01) H05K 1/16 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2352929

A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5.ANG. and about 70.ANG.. A vapor deposited resistive material is provided on the stabilization layer.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming chromium coated copper for printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming chromium coated copper for printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming chromium coated copper for printed circuit... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1787614

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.