Method of forming circuit assembly

Details Method of forming circuit assembly Method of forming circuit assembly

H - Electricity

05

K

H05K 3/20 (2006.01) G01V 15/00 (2006.01) H01Q 1/38 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2569694

The present invention is directed to a method of forming a circuit assembly, such as including a radio frequency identification device (RFID), wherein first and second portions of an antenna of the circuit assembly are provided on respective first and second substrates, with the associated electrical circuit, having first and second electrical contacts on respective opposite sides thereof, positioned between the first and second substrates. Alternatively, first and second portions of an antenna of the circuit assembly are provided on a substrate, with the associated electrical circuit, having first and second electrical contacts on respective opposite sides thereof, electrically joined to the respective antenna portions. Highly efficient manufacture is thus promoted.

L'invention concerne un procédé de formation d'un montage de circuits, tel qu'un montage comprenant un dispositif d'identification par radiofréquence (RFID), des première et deuxième parties d'une antenne du montage de circuits étant disposées respectivement sur des premier et deuxième substrats, le circuit électrique associé, qui comprend des premier et deuxième contacts électriques respectivement sur ses côtés opposés, étant disposé entre les premier et deuxième substrats. En variante, les première et deuxième parties d'une antenne du montage de circuits sont disposées sur un substrat, le circuit électrique associé, qui comprend des premier et deuxième contacts électriques respectivement sur ses côtés opposés, étant relié électriquement aux parties d'antenne respectives. Le procédé selon l'invention permet d'obtenir une fabrication extrêmement efficace.

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