Method of forming conductive paths on a substrate having...

H - Electricity – 01 – L

Patent

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H01L 23/52 (2006.01) G02B 6/36 (2006.01) H01L 21/48 (2006.01) H01L 23/522 (2006.01) H01L 23/532 (2006.01) H01L 31/02 (2006.01) H01L 31/18 (2006.01) H01P 3/08 (2006.01) G02B 6/42 (2006.01) H05K 1/00 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2166037

The invention concerns a method of forming a number of electric conductors at a very short distance from the end of depressions such as V-grooves on a substrate. In one configuration example, a film of PTFE or of a similar material is laminated over the entire surface of the substrate. Holes are etched in the film. The holes are metallized. Conductive paths are formed, which are electrically connected to the metallized holes. The film in the area of the grooves is removed by etching. In another configuration example, the grooves are temporarily filled with a photoresist and the conductive paths and contact surfaces or bumps are formed in accordance with a photolithographic method.

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