Method of forming conductive tracks on a semiconductor device

Details Method of forming conductive tracks on a semiconductor device Method of forming conductive tracks on a semiconductor device

H - Electricity

05

K

356/16

H05K 3/02 (2006.01) H01L 23/482 (2006.01)

Patent

CA 1090477

ABSTRACT: A method of manufacturing crossing wirings for L.S.I. After providing the lowermost conductor pattern, an intermediate layer of metal is provided over the whole surface. A second conductor pattern is then formed on the intermediate layer, after which the intermediate layer is removed selectively by underetching except at the area of connections between the two conductor levels. - - - -20-

284097

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