Method of forming dielectric thin film pattern and method of...

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H01L 21/203 (2006.01) H01L 21/02 (2006.01) H01L 21/027 (2006.01) H01L 21/316 (2006.01) H05K 1/02 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2290764

A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO2, Sm2O3, Dy2O3, Y2O3, TiO2, Al2O3 and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.

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