Method of forming electrically conducting layer

Details Method of forming electrically conducting layer Method of forming electrically conducting layer

H - Electricity

05

K

356/12, 204/91.4

H05K 3/10 (2006.01) B05D 3/06 (2006.01) G03F 7/032 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2007180

METHOD OF FORMING ELECTRICALLY CONDUCTING LAYER Abstract A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of: (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator; (b) applying the composition to the conducting surface to form a coated layer; (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer, (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and (e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).

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