Method of forming lines of weakness in or grooving a plastic...

B - Operations – Transporting – 31 – F

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B31F 1/08 (2006.01) B23K 26/00 (2006.01) B29C 59/00 (2006.01) B29C 35/08 (2006.01) B29C 37/00 (2006.01) B29C 65/16 (2006.01) B41M 5/24 (2006.01) B41M 5/26 (2006.01)

Patent

CA 2017122

A method of forming lines of weakness in or grooving a plastic material, especially a packaging material, by local vaporization or degradation by means of a laser beam, which laser beam and which plastic or packaging material can be moved in relation to each other, wherein the laser beam is generated by means of a wavelength tunable laser tuned to a wavelength selected on the basis of the wavelength depending absorption spectrum of the material to be processed.

L'invention est une méthode de formation de lignes de moindre résistance ou de sillons dans un matériau de plastique, particulièrement un matériau d'emballage, par vaporisation ou dégradation locale au moyen d'un faisceau laser, lequel faisceau laser et lequel matériau de plastique ou d'emballage peuvent être déplacés l'un par rapport à l'autre, le faisceau laser étant produit au moyen d'un laser accordable en longueur d'onde qui est accordé à une longueur d'onde choisie selon le spectre d'absorption du matériau à traiter.

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