B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 35/363 (2006.01) B23K 3/06 (2006.01) B23K 35/02 (2006.01) B23K 35/26 (2006.01) B23K 35/36 (2006.01) H01L 23/495 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2109462
A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
Kuramoto Takeo
Noda Satoshi
Sakai Takekazu
Shoji Takashi
Watabe Masataka
Riches Mckenzie & Herbert Llp
Showa Denko K.k.
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