Method of forming via hole using laser beam

Details Method of forming via hole using laser beam Method of forming via hole using laser beam

H - Electricity

01

L

H01L 21/768 (2006.01)

Patent

CA 2571980

Provided is a method of forming a via hole using a laser beam. The method includes forming a first hole in the first metal layer by irradiating a laser beam having a predetermined frequency; reducing an energy density of the laser beam having the same frequency; and forming a second hole corresponding to the first hole in the dielectric layer by irradiating the laser beam having the same frequency.

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