Method of forming wiring pattern

Details Method of forming wiring pattern Method of forming wiring pattern

H - Electricity

05

K

H05K 3/02 (2006.01) H01L 21/027 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2290306

A method of forming a wiring pattern which includes the steps of: forming a resist pattern having a shrinkage-inhibiting effect on a substrate; releasing gas from the resist pattern by baking the resist pattern; film-forming an electrode material on the substrate and the resist pattern while the temperature of the substrate is kept lower than the baking temperature of the resist pattern; and removing the electrode material on the resist pattern by separating the resist pattern from the substrate.

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