Method of grinding a sapphire substrate

Details Method of grinding a sapphire substrate Method of grinding a sapphire substrate

B - Operations, Transporting

24

B

B24B 1/00 (2006.01) B24B 7/22 (2006.01)

Patent

CA 2673523

A method of machining a sapphire substrate comprises grinding a first surface of a sapphire substrate using a first fixed abrasive and grinding said first surface of the sapphire substrate using a second fixed abrasive, wherein the second fixed abrasive has a smaller average grain size than the first fixed abrasive, and wherein the second, fixed abrasive is self -dressing.

L'invention concerne un procédé d'usinage d'un substrat de saphir comportant le meulage d'une première surface d'un substrat de saphir en utilisant un premier abrasif fixe et le meulage de la première surface du substrat de saphir en utilisant un second abrasif fixe, le second abrasif fixe ayant une dimension moyenne de grain plus petite que le premier abrasif fixe, et dans lequel le second abrasif fixe est auto-traitant.

Affiliated with

Also associated with

Rating

Method of grinding a sapphire substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of grinding a sapphire substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of grinding a sapphire substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1950148