Method of improving block resistance of adhesive compositions

Details Method of improving block resistance of adhesive compositions Method of improving block resistance of adhesive compositions

C - Chemistry, Metallurgy

09

J

C09J 177/08 (2006.01) C09J 5/06 (2006.01) C09J 177/06 (2006.01)

Patent

CA 2224323

A method is disclosed for improving the block resistance of adhesive compositions containing at least one polyamide resin including the steps of: (1) forming an adhesive composition containing a polyamide resin which is the reaction product of: (a) an acid component of from: (i) about 10 to about 80 equivalent % of a polymeric fatty acid; and (ii) about 10 to about 95 equivalent % of a dicarboxylic acid; and (b) a substantially equivalent amount of an amine component of from: (i) about 60 to about 95 equivalent % of a cycloaliphatic diamine; and (ii) greater than about 0 to less than about 20 equivalent % of ethylenediamine; and (2) applying said adhesive composition to a first substrate; and (3) adhering said first substrate to a second substrate at a heat seal temperature less than about 300 ~F.

L'invention a pour objet un procédé pour améliorer la résistance à l'adhésion par contact de compositions adhésives contenant au moins une résine de polyamide. Ce procédé consiste à (1) former une composition adhésive contenant une résine de polyamide qui est le produit de réaction:(a) d'un constituant acide compris entre (i) environ 10 et environ 80 % équivalent d'un acide gras polymère; et (ii) 10 et environ 95 % équivalent d'un acide dicarboxylique; et (b) une quantité sensiblement équivalente d'un constituant amine compris entre: (i) environ 60 et 95 % équivalent d'une diamine cycloaliphatique; et (ii) de plus de 0 à moins d'environ 20 % équivalent d'éthylènediamine; et (2) appliquer une composition adhésive à un premier substrat; et (3) faire adhérer le premier substrat à un deuxième substrat à une température de thermocollage inférieure à environ 300 ·F.

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