Method of improving the bond strength of electrolessly...

Details Method of improving the bond strength of electrolessly... Method of improving the bond strength of electrolessly...

C - Chemistry, Metallurgy

23

C

117/77, 117/90

C23C 18/28 (2006.01) C23C 18/30 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1272079

Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces Abstract Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or un- saturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.

543064

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