Method of indirectly connecting two parts

Details Method of indirectly connecting two parts Method of indirectly connecting two parts

B - Operations, Transporting

23

K

26/106

B23K 35/00 (2006.01) B23K 20/24 (2006.01) C03C 27/08 (2006.01)

Patent

CA 1105247

Abstract of the Disclosure Two parts, such as a quartz part and piezo-electric part, are indirectly connected to one another by applying relatively thin metallic layers having a thickness of about 0.5 nm to 55 nm under vacuum conditions onto the surfaces of such parts to be joined and then contacting the free surfaces of such metallic layers with one another under vacuum conditions whereby a sub- stantially permanent bond is formed between such layer.

311768

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