Method of indirectly connecting two parts

Details Method of indirectly connecting two parts Method of indirectly connecting two parts

B - Operations, Transporting

23

K

26/106

B23K 1/20 (2006.01) B23K 20/24 (2006.01) B23K 35/00 (2006.01) C03C 27/08 (2006.01)

Patent

CA 1105248

ABSTRACT OF THE DISCLOSURE A method of indirectly connecting two parts, such as an acousto-optical building component composed of lead glass and a piezo electric transducer composed of lead-zirconium titanate, whereby at least one mono-molecular layer (having a maximum thick- ness of 100 nm) composed of a lead-free glass is directly applied under vacuum onto the surfaces of the parts to be joined and metal layers are then applied under vacuum onto such glass layer and/or the surfaces to be joined so that when the free surfaces of such free metal layers are brought into contact with one another under vacuum, a bond forms therebetween and such bonds indirectly connect the parts with one another. The glass layer prevents diffusion of atoms or ions from the materials (such as lead) on either side of such layer so that the parts so-joined and/or the bonds so-formed are not impaired in any way.

311769

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