Method of joining a first component to a second component...

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 15/00 (2006.01) B23K 26/34 (2006.01) C09J 5/02 (2006.01) F16B 5/07 (2006.01)

Patent

CA 2752063

The present application relates to a method of joining a first component (1) to a second component, the method comprising preparing the first component (1) by forming an array of elongate projections (3) on a bond surface (2) of the component (1), each projection (3) having a centreline, a tip, and a base. The centreline at the tip of each projection (3) is oriented at an angle with respect to the normal to the bond surface (2) at its base, and the angular orientation of the tip centrelines varies across the array of projections (3). Next, the first component (1) and a flexible layer are brought together so as to embed the projections (3) in the flexible layer before hardening the flexible layer to form the second component. Also, a joint so formed.

La présente invention porte sur un procédé de liaison d'un premier composant (1) et d'un second composant, le procédé comprenant la préparation du premier composant (1) par formation d'un réseau de saillies allongées (3) sur une surface de liaison (2) du composant (1), chaque saillie (3) ayant un axe médian, une pointe et une base. L'axe médian à la pointe de chaque saillie (3), est orienté selon un angle par rapport à la normale de la surface de liaison (2) à sa base, et l'orientation angulaire des axes médians des pointes varie dans l'ensemble du réseau de saillies (3). Ensuite, le premier composant (1) et une couche souple sont amenés en contact l'un avec l'autre de façon à faire pénétrer les saillies (3) dans la couche souple avant le durcissement de celle-ci pour former le second composant. L'invention porte également sur une liaison ainsi formée.

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