Method of joining semiconductor substrates

Details Method of joining semiconductor substrates Method of joining semiconductor substrates

H - Electricity

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356/168

H01L 21/762 (2006.01) H01L 21/20 (2006.01) H01L 21/316 (2006.01)

Patent

CA 1244968

- 17 - Abstract of the Disclosure A method of manufacturing a semiconductor substrate includes the steps of performing flame electrolysis on a glass source with an oxyhydrogen flame, spray-depositing the resultant glass particles on a joint surface of a semiconductor substrate, placing another semiconductor substrate on the deposited glass particles and perform- ing heat-treatment, and joining the two substrates by sintering the glass particles.

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