Method of laser soldering

Details Method of laser soldering Method of laser soldering

B - Operations, Transporting

23

K

327/1.3

B23K 26/00 (2006.01) B23K 1/005 (2006.01) H05K 3/34 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1212426

- 21 - ABSTRACT A method of soldering electrical lead strands (of a width at least .3 inch) to a printed electrical path is disclosed. The path is planted on an alumina ceramic substrate and a solder pad is attached to a portion of the path A flat surface portion of each lead strand is forced into full interengagement with a pad, a CO2 defocused laser beam is directed onto the soldering assembly with the beam controlled to have a beam power of at least 100 watts, a beam spot diameter no less than the width of the lead strand and no greater than the width of the pad, and a beam on-time effective to exert a controlled thermal radius on the soldering assembly to reflow only a preselected portion of the pad and effect a solder joint between the pad and strand portion, the joint having a strength of at least 400 grams.

445876

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