Method of machine cutting silicon metal particulates with...

Details Method of machine cutting silicon metal particulates with... Method of machine cutting silicon metal particulates with...

B - Operations, Transporting

26

D

164/18

B26D 1/00 (2006.01) B28D 1/22 (2006.01)

Patent

CA 1233110

-13- ABSTRACT A method is disclosed of machine cutting a semidense silicon comprising particulate body by relatively moving a substantially fully dense silicon nitride cutting tool against the body. The silicon nitride tool experiences increased tool life over that of carbides or tool steels heretofore used to machine cut low density, highly abrasive metals.

476705

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