Method of machining a substrate

Details Method of machining a substrate Method of machining a substrate

B - Operations, Transporting

22

F

B22F 3/12 (2006.01) B23C 5/20 (2006.01)

Patent

CA 2678597

The invention provides for a method of machining a substrate which includes the step of machining the substrate in an interrupted machining, impact machining or combination thereof operation using a tool which includes a tool component comprising a layer of polycrystalline diamond (12) having a working surface (16), a softer layer (20) containing a metal and bonded to the working surface (16) of the polycrystalline diamond layer (12) along an interface, the region (22) of the layer of poiycrystalline diamond (12) adjacent the interface containing some metal from the softer layer (20).

Cette invention concerne un procédé d'usinage d'un substrat, qui consiste à usiner le substrat en une opération d'usinage discontinu, d'usinage par impact, ou d'usinage combinant ces deux techniques, à l'aide d'un outil qui comprend un élément d'outil constitué d'une couche de diamant polycristallin (12) présentant une surface de travail (16), une couche plus tendre (20) contenant un métal et collée à la surface de travail (16) de la couche de diamant polycristallin (12) le long d'une interface (14), la zone de la couche de diamant polycristallin (12) adjacente à l'interface (14) contenant un peu du métal de la couche plus tendre (20).

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