Method of making a metallic pattern on a substrate

C - Chemistry – Metallurgy – 25 – D

Patent

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Details

204/97.03

C25D 13/06 (2006.01) C25D 13/12 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2018249

Case K-17614/=/ARL 397 A METHOD OF MAKING A METALLIC PATTERN ON A SUBSTRATE ABSTRACT OF THE DISCLOSURE A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises (i) protecting the bare metal by electrodepositing thereon a film of an organic resin, (ii) immersing the substrate bearing the electrodeposited resin film in an aqueous solution or dispersion of a hardening agent for said film, said hardening agent being a material which is curable, either alone or through reaction with functional groups in the electrodeposited resin film, on heating or irradiation, whereby said aqueous solution or dispersion diffuses into the surface of the electrodeposited resin film, (iii) subjecting the substrate to curing conditions for the hardening agent, thereby hardening the surface of the electro- deposited film and rendering it resistant to a solvent used to remove the resist and resistant to an etchant used to remove metal from areas exposed by removal of the resist, (iv) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited resin film, and (v) etching metal exposed in step (iv) using an etchant which does not remove the electrodeposited resin film.

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