B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 1/19 (2006.01) H01L 21/60 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2116269
The present invention is embodied in a technique for precise and accurate heightcontrol in fabricating solder bumps or joints formed from a solder bump or bumps. A solder bump is formed by reflow of a conical solder body having base diameter D,height H and cone angle .THETA., and has truncated sphere shape, with height h and truncation diameter d. We have found that D, H, and d can be selected such that ?h/?H is small (typically ? 0.5), indicative of relative insensitivity of the bump height to variation in the height of the conical solder body. The inventive process is also applicable to a component (e.g., a laser) solder-bonded to a substrate, and can provide previously unattainable control of the spacing between component and substrate.
Dudderar Thomas Dixon
Wong Chee Cheong
American Telephone And Telegraph Company
Kirby Eades Gale Baker
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