Method of making an electronic device cooling system

Details Method of making an electronic device cooling system Method of making an electronic device cooling system

C - Chemistry, Metallurgy

25

D

C25D 5/00 (2006.01) C23C 14/34 (2006.01) H01L 23/473 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2570847

A method is provided. The method includes forming a conductive layer on an inner surface of a substrate (12) and providing a sacrificial layer (36) over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer (36) and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer (36) to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer (36) is etched.

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