Method of making conductive via holes in printed circuit boards

Details Method of making conductive via holes in printed circuit boards Method of making conductive via holes in printed circuit boards

H - Electricity

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K

356/18

H05K 3/10 (2006.01) H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/42 (2006.01) H05K 3/22 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1120602

METHOD OF MAKING CONDUCTIVE VIA HOLES IN PRINTED CIRCUIT BOARDS Abstract of the Disclosure A printed circuit board is provided with via holes and these holes are provided with a base coat of conductive metal, a coating of insulating material deposited on said base coat, and a second coat of conducting metal deposited on said insulating material. The metal coatings are interconnected to one or more surfaces of the board and the base coat is connected to at least one internal power, ground or signal plane. This via hole construction facilitates the making of engineering changes by simply deleting the interconnection between the metal coatings at the board surface and subse- quently connecting the desired point to an alternate point on the circuit board. En977011

321411

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