Method of making multilayered ceramic structures having an...

H - Electricity – 05 – K

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356/122, 25/128,

H05K 3/46 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1326789

METHOD OF FAKING MULTILAYERED CERAMIC STRUCTURES HAVING AN INTERNAL DISTRIBUTION OF COPPER-BASED CONDUCTORS ABSTRACT OF THE DISCLOSURE The Present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

534156

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