Method of making packaged ic chip

Details Method of making packaged ic chip Method of making packaged ic chip

H - Electricity

01

L

356/117, 356/146

H01L 21/50 (2006.01)

Patent

CA 1234926

D-84-2-039 ABSTRACT OF THE DISCLOSURE In the manufacture of a packaged IC chip, a lead frame segment has a plurality of leads, the ends of which are connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.

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