Method of making photovoltaic device

Details Method of making photovoltaic device Method of making photovoltaic device

H - Electricity

01

L

H01L 31/04 (2006.01) H01L 31/042 (2006.01) H01L 31/048 (2006.01) H01L 31/16 (2006.01)

Patent

CA 2310571

A photovoltaic device and a method for its manufacture. The device essentially comprises a thin film cell layer 14, a contact transfer release sheet 54, and a foil strip interconnect clip 80. The contact transfer release sheet 54 is bonded to the thin film cell layer 14 in vacuum deposition chambers 12 to produce a roll 62 of photovoltaic material. The photovoltaic material is then cut into segments that are referred to as thin film cell stickers 64. The thin film cell stickers have a barrier layer which is removable to expose a ready-to-apply sticker. The stickers 64 are then adhered to a substrate, like glass, and arranged, side by side, in a row 66. Row 66 of stickers 64 is formed into a series or parallel circuit using a conductive foil strip interconnect clip 80. The interconnect clip is used to complete the circuit between adjacent thin film stickers, preferably by crimping the interconnect to adjacent bus bar segments 87 & 91, of adjacent stickers 64.

L'invention concerne un dispositif photovoltaïque et son procédé de fabrication. Ce dispositif comprend une fine couche cellulaire (14), une feuille détachable par contact (54) et un clip d'interconnexion en bande (80). La feuille détachable (54) est liée à la couche (14) dans des chambres de dépôt sous vide (12) pour obtenir un rouleau (62) de matière photovoltaïque qui est ensuite coupée en segments qui sont appelés ici adhésifs à fine couche cellulaire (64). Ces derniers ont une couche barrière qui peut être détachée afin de coller l'adhésif. Ces adhésifs (64) sont ensuite collés sur un substrat, de type verre, et disposés côte à côte en rangée (66). Cette rangée (66) d'adhésifs (64) devient un circuit monté en série ou parallèle utilisant le clip d'interconnexion en bande (80). Ce dernier sert à incorporer le circuit entre les adhésifs adjacents par sertissage, de préférence, de l'interconnexion avec des segments de barres omnibus adjacents (87, 91) d'adhésifs adjacents (64).

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