Method of making planarized josephson junction devices

G - Physics – 11 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

352/49

G11C 11/44 (2006.01) H01L 39/24 (2006.01)

Patent

CA 1190648

ABSTRACT OF THE DISCLOSURE The present invention teaches a method of planarizing built-up vacuum deposited surfaces or areas on Josephson junction and semiconductor devices so that successively deposited layers do not replicate the undulations of previous layers. After a surface layer is deposited in a vacuum system and part of the surface is etched, a raised surface is generated. A photoresist lift-off stencil is applied to the surface to be preserved and the material to be removed is removed by isotropically etching so as to leave an overhang or ledge of photoresist material over the area of the material retained. A new layer of material is now deposited by vacuum deposition so as to almost fil the area to be planarized. A small gap remains between the top of the new material being vacuum de- posited and the bottom of the photoresist stencil so that solvent can be introduced to the stencil. When the photoresist stencil is removed, the top of surface being preserved is substantially planar with the new layer of material.

423724

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method of making planarized josephson junction devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making planarized josephson junction devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making planarized josephson junction devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1191751

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.