Method of making sputter target/backing plate assembly

Details Method of making sputter target/backing plate assembly Method of making sputter target/backing plate assembly

C - Chemistry, Metallurgy

23

C

C23C 14/34 (2006.01) B23K 20/02 (2006.01) B23K 20/233 (2006.01)

Patent

CA 2218022

This invention is directed to a method for making a bonded sputter target/backing plate assembly (20) as well as assemblies produced therefrom. The assembly includes a sputter target (10) having a bonding surface (12) which is bonded to the bonding surface (18) of an underlying backing plate (16). The method of forming the bonded assembly (20) includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness of at least about 120 R, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target (10) and backing plate (16) to form an assembly (20) having an interface defined by the bonding surfaces, subjecting the assembly (20) to a controlled atmosphere, heating the assembly (20), and pressing the assembly (20) so as to bond the bonding surfaces (12, 16).

Cette invention concerne un procédé de fabrication d'un ensemble soudé (20) constitué d'une cible de pulvérisation et d'une plaque de support ainsi que les ensembles obtenus par ledit procédé. Un tel ensemble comporte une cible de pulvérisation (10) ayant une surface de métallisation (12) qui est soudée à la surface de métallisation (18) d'une plaque de support sous-jacente. Le procédé de fabrication de l'ensemble soudé (20) consiste à traiter l'une des surfaces de métallisation, soit en rendant rugueuse au moins une partie de l'une de ces surfaces de métallisation de façon à obtenir une partie rugueuse ayant une rugosité de surface au moins égale à 120 R, ou en perçant une pluralité de trous dans l'une de ces surfaces. Ledit procédé consiste à orienter ensuite la cible de pulvérisation (10) et la plaque de support (16) pour former un ensemble (20) ayant une interface définie par les surfaces de métallisation, à soumettre l'ensemble (20) à une atmosphère contrôlée, à chauffer ledit ensemble (20) et à le comprimer de façon à souder les surfaces de métallisation (12, 16).

Affiliated with

Also associated with

Rating

Method of making sputter target/backing plate assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making sputter target/backing plate assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making sputter target/backing plate assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1879505