Method of manufacturing a hermitically sealed electronic...

Details Method of manufacturing a hermitically sealed electronic... Method of manufacturing a hermitically sealed electronic...

H - Electricity

01

C

26/112, 338/25

H01C 17/28 (2006.01) H01C 1/024 (2006.01)

Patent

CA 1082900

Abstract of the disclosure A method of manufacturing a passive hermetically sealed electronic component having a coupling element of soft alloy material between the component element and the leads for providing strain relief. The component element is composed of a passive element having coated ends composed of a refractory metallic material for providing reliable electrical and mechanical connection to the coupling element. -1-

298319

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