H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2110679
2110679 9222192 PCTABS00018 A process for manufacturing a multilayer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate (8) based on a UD-reinforced synthetic material, provided on either side with traces (7), is combined with and bonded to a back-up substrate (9), wherein during the laminating process the back-up substrate (9) is added to the basic substrate, the back-up substrate (9) comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer (15), and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces (7) of the basic substrate (8), and the space between these traces is filled with the adhesive material, so bonding the basic substrate (8) and the back-up substrate (9).
Middelman Erik
Zuuring Pieter Hendrik
Amp-Akzo Linlam Vof
Swabey Ogilvy Renault
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