Method of manufacturing a printed circuit board assembly

Details Method of manufacturing a printed circuit board assembly Method of manufacturing a printed circuit board assembly

H - Electricity

05

K

H05K 3/34 (2006.01) H05K 1/02 (2006.01) H05K 7/20 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2226149

The present invention provides a method of making a printed circuit board assembly. The method includes the steps of applying a solder paste to a substrate and partially filling vias in the substrate and assembling electrical components thereto. The method further includes heating the printed circuit board to cause the solder paste to reflow and then cooling the printed circuit board.

Cette invention concerne une méthode de fabrication de plaquettes à circuits imprimés selon les étapes suivantes : application d'une couche de soudure en pâte sur un substrat, remplissage partiel des trous d'interconnexion et montage des composants électriques. La méthode objet de l'invention prévoit en outre le chauffage de la plaquette pour fluidifier la soudure en pâte et le refroidissement subséquent de la plaquette.

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