Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

C - Chemistry, Metallurgy

30

B

148/3.2

C30B 33/08 (2006.01) H01L 21/268 (2006.01) H01L 21/306 (2006.01) H01L 21/78 (2006.01)

Patent

CA 1099618

ABSTRACT: The invention relates to a method of manufacturing semiconductor devices each comprising a semiconductor body having a desired structure, in which a disc of semiconductor material is subjected at a major surface to treatments in which a plurality of such desired structures is is obtained, after which the disc is severed to semiconductor bodies each having the desired structure by means of laser beam cutting. According to the invention, material formed during cutting the disc is otchod away preferentially with respect to the semiconductor material.

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