Method of manufacturing a thermal print head

Details Method of manufacturing a thermal print head Method of manufacturing a thermal print head

H - Electricity

05

K

26/200

H05K 3/34 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1240134

ABSTRACT A method of manufacturing a thermal print head includes the step of coating a channel 12 of a fixture 10 with a first adhesive 26. Integrated circuit packages 20 are placed in the channel 12 with heating elements 22 disposed toward the bottom 14 of the channel 12. The packages 20 are held in position by a jig 30 while the adhesive 26 is thermally activated. A groove 52 in the face of a heat sink 50 is filled with a first part 54 of a two part adhesive and the integrated circuit packages 20 coated with the second part 56 of the two part adhesive. The alignment fixture 10 is positioned over the heat sink 50 activating the two part adhesive. The temperature of the assembly is elevated causing the first adhesive 26 to release and the second adhesive 54, 56 to further cure thus securing the packages 20 to the heat sink 50. Printed circuit cables 60, 70 are soldered to the packages 20.

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