Method of manufacturing an integrated circuit device

Details Method of manufacturing an integrated circuit device Method of manufacturing an integrated circuit device

H - Electricity

01

L

356/139

H01L 23/544 (2006.01)

Patent

CA 1205576

-1- Abstract: A method for manufacturing an integrated circuit device illustrates the preparation of the first surface of a circuit wafer including the placement of fine alignment indicia 34a outside the active chip area. A support wafer 50 is secured to the first surface of the circuit wafer 10 by an adhesive layer 58. The circuit wafer 10 is thinned. Openings 66 are photoshaped in the circuit wafer 10 using wafer flats 51 for alignment. The openings expose alignment indicia 34a which are relief images in the adhesive of the alignment pattern 34. The exposed surface of the circuit wafer 10 is photoshaped, using the indicia 34a for alignment, to define wafer segments 68 positioned over resistor doped regions 22.

456901

Affiliated with

Also associated with

Rating

Method of manufacturing an integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing an integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1323587