Method of manufacturing an intracutaneous microneedle array

Details Method of manufacturing an intracutaneous microneedle array Method of manufacturing an intracutaneous microneedle array

B - Operations, Transporting

29

C

B29C 59/02 (2006.01) A61M 37/00 (2006.01) B29C 59/16 (2006.01) C25D 5/56 (2006.01)

Patent

CA 2689890

A microneedle array is manufactured using a mold preparation procedure that begins try placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles. If the microneedles are hollow, then an additional procedure is used to create through-holes all the way through the underlying substrate material using laser optical means.

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