H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/304 (2006.01) H01L 21/302 (2006.01) H01L 21/461 (2006.01)
Patent
CA 2406424
A method of manufacturing a compound semiconductor wafer with less adhesion of particles, surface oxidization, and deterioration and reducing the consumed amount of organic solvent, comprising the steps of sticking a suction pad on a polishing plate, polishing a wafer in the sucked state onto the suction pad without using wax, and storing the wafer in pure water without drying, wherein, since the wafer is stored in the pure water, the adhesion of particles, surface oxidization, and deterioration become less, and the high quality wafer can be obtained, the cleaning of the organic solvent being eliminated in a cleaning process after the storage in water, whereby the consumed amount and waste amount of the harmful organic solvent can be reduced.
L'invention porte sur un procédé de fabrication de tranches composées de semi-conducteurs avec moins d'adhérence de particules, moins d'oxydation et de détériorations de la surface, et une consommation réduite de solvant organique comportant les étapes suivantes: fixation d'un plateau ventouse à une plaque de polissage; polissage sans cire de la tranche ainsi fixée; stockage de la tranche dans de l'eau pure sans séchage. Ce stockage dans l'eau pure réduit l'adhérence des particules, l'oxydation et les détériorations de la surface et donne une tranche de grande qualité. On élimine en outre le rinçage du solvant organique lors de la phase de nettoyage après le stockage dans l'eau, ce qui permet de réduire la consommation et les rejets de solvant organique nocif.
Mezaki Yoshio
Morimoto Toshiyuki
Okamoto Takatoshi
LandOfFree
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