H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/113
H01L 23/427 (2006.01) F28D 15/02 (2006.01)
Patent
CA 2026437
- 16 - A B S T R A C T In a method of manufacturing a heat pipe semicon- ductor cooling apparatus of this invention, one or a plurality of through holes are formed in a metal elongated member, and the metal elongated member is cut into a predetermined length to obtain a desired metal block. End portions of the through holes of the metal block are sealed, these parts are bonded by heating to constitute a heat-absorbing portion, and one end portion of a heat pipe is inserted in each through hole. Alternatively, after one end portion of a heat pipe is inserted in each through hole, an end portion of the through hole is sealed, and these parts are bonded by heating to constitute a heat-absorbing portion. Fins are mounted on the other end portions of the heat pipes by press fitting to constitute a radiating portion.
Ridout & Maybee Llp
The Furukawa Electric Co. Ltd.
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