H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/16
H05K 3/00 (2006.01) H05K 3/46 (2006.01) H05K 1/18 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2006776
ABSTRACT OF THE DISCLOSURE METHOD OF MANUFACTURING MULTILAYERED PRINTED-WIRING-BOARD A method of manufacturing a multilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.
Eimura Takeshi
Kinoshita Masaki
Ohiwa Takao
Takahashi Eiki
Teshigawara Osamu
Gowling Lafleur Henderson Llp
Japan Radio Co. Ltd.
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