Method of manufacturing multilayered printed-wiring-board

H - Electricity – 05 – K

Patent

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H05K 3/00 (2006.01) H05K 3/46 (2006.01) H05K 1/18 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2006776

ABSTRACT OF THE DISCLOSURE METHOD OF MANUFACTURING MULTILAYERED PRINTED-WIRING-BOARD A method of manufacturing a multilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.

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