Method of manufacturing printed circuit boards

Details Method of manufacturing printed circuit boards Method of manufacturing printed circuit boards

H - Electricity

05

K

356/1

H05K 1/00 (2006.01)

Patent

CA 1070024

ABSTRACT OF THE DISCLOSURE Manufacture of photosensitive material by a dispersion of parti- cles of semiconducting metal oxide having a charge sign opposite to that of substrate in the dispersion agent, which dispersion is provided on the sub- strate surface and adhered thereto. In a similar manner walls of a hole for electrical through-connections are made photosensitive as a pretreatment for metal-plating.

305493

Affiliated with

Also associated with

Rating

Method of manufacturing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-642214