H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/16, 204/12.5
H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01) H05K 1/11 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1236221
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS Abstract of the Disclosure A method of producing a printed circuit board comprising the steps of applying a layer of electri- cally conductive material on at least one side of a printed circuit board, cleaning the surface of the electrical conductive layer, printing a plating resist onto the layer so as to expose only the required trace area of an electrical circuit pattern, electroplating over the layer of electrically conductive material a layer of nickel metal which has a melting point suffi- ciently high to prevent movement in a molten state during a subsequent soldering operation, removing the plating resist by etching leaving a nickel layer on the trace areas of the circuit pattern, applying a solder resist to the layer so as to expose only the plated-through holes and other connecting sites of the board such as contact fingers and connecting pads, removing the nickel metal from the exposed area of the board, and applying a layer of sealant to retard copper oxidation and/or promote solderability of the exposed plated-through holes, the connecting pads and the contact fingers.
507988
Ncr Corporation
Smart & Biggar
LandOfFree
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