H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 3/06 (2006.01) B23K 35/00 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01) H05K 3/38 (2006.01) H05K 3/10 (2006.01) H05K 3/28 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1213073
METHOD OF MANUFACTURING PRINTED WIRING BOARDS BY JAMES ALLAN COPPIN ABSTRACT OF DISCLOSURE An improved method of manufacturing a printed wiring board having the characteristics of one with a solder mask over bare copper for circuit traces and ground planes. The method includes the step of electroplating a very thin coating of tin-lead over the circuit traces, ground planes, holes and circuit pads prior to selectively coating only the pads and holes with a relatively thick coating of tin-lead solder plate. After removing the plating resist which defines the areas for selective solder coating, the board is chemically etched and then mechanically scrubbed to roughen the surface of and reduce the thickness of the thin solder plate. A solder mask may be applied over circuit traces and ground planes prior to reflowing the thick coating of solder plate. Assembled printed wiring boards may then be wave soldered without wrinkling of the solder mask.
466404
Microtel Limited
R. William Wray & Associates
LandOfFree
Method of manufacturing printed wiring boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing printed wiring boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed wiring boards will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1328441