Method of manufacturing resin overlay plate

Details Method of manufacturing resin overlay plate Method of manufacturing resin overlay plate

B - Operations, Transporting

32

B

154/87, 154/95

B32B 21/02 (2006.01) B32B 21/10 (2006.01) B32B 21/14 (2006.01) B32B 27/12 (2006.01) E04G 9/05 (2006.01)

Patent

CA 2016367

ABSTRACT OF THE DISCLOSURE In forming a polyolefin resin film on the surface of a wood plate, the polyolefin resin film is first formed on a non woven fabric, to manufacture a composite sheet having the polyolefin resin film formed on the non woven fabric. Then, this composite sheet is superimposed on the wood plate through adhesive with the non woven fabric being on the side of the wood plate and then, pressed to bond the composite sheet to the wood plate. The composite sheet having the polyolefin resin film formed on the non woven fabric is manufactured, and this composite sheet on the side of the non woven fabric is bonded to the wood plate. Accordingly, reactive curing adhesive commonly employed can be utilized for bonding the composite sheet to the wood plate. Furthermore, in bonding the composite sheet to the wood plate by heating, the non woven fabric, on the side of which the composite sheet is bonded, in the composite sheet becomes an escape route of water vapor emitted from the wood plate, thereby causing no bubble troubles. Consequently, in the processes of manufacturing the wood plate such as plywood, a particle board or a wafer board, the composite sheet can be bonded to the wood plate simultaneously with the manufacture of the wood plate.

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