Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

H - Electricity

01

L

H01L 21/58 (2006.01) H01L 21/00 (2006.01) H01L 21/76 (2006.01) H01L 21/98 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01)

Patent

CA 2117818

ABSTRACT OF THE DISCLOSURE A method of manufacturing a semiconductor device having a package including a base, and a chip mounted on the base, wherein the chip has a surface on which an element is formed, the method comprising the steps of (a) fixing the chip having a protective coat formed on the surface to the base; and (b) removing the protective coat from the chip without touching the chip.

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