Method of manufacturing thick-film devices

Details Method of manufacturing thick-film devices Method of manufacturing thick-film devices

H - Electricity

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K

356/5

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H01L 23/64 (2006.01) H05K 3/10 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2016851

ABSTRACT OF THE DISCLOSURE A method of fabricating a multilayer ceramic device of the type which has conductive paths in parallel planes spaced by a dielectric including hollow microspheres of glass, uses the steps of separately applying to a ceramic substrate (12), a green ceramic tape (16) and a layer of hollow microspheres; the resulting structure is fired. The dielectric constant between the conductive paths is thus reduced, resulting in low capacitance and increased speed of circuitry. Fig 3

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