B - Operations – Transporting – 22 – F
Patent
B - Operations, Transporting
22
F
B22F 9/08 (2006.01) B22F 5/00 (2006.01) B22F 5/12 (2006.01) B23K 35/02 (2006.01) B23K 35/26 (2006.01) H05K 3/10 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2210063
The disclosed invention provides for a method of manufacturing solder columns for particular use in attaching substrates to a printed circuit board. The method results in columns of homogeneous composition and thus overcomes problems associated with the phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing ingots of the composition into wire and severing the wire into segments.
La présente invention a trait à une méthode de fabrication de colonnes à souder utilisées particulièrement pour fixer des substrats à une plaque de circuits imprimés. La méthode permet d'obtenir des colonnes à souder de composition homogène et de surmonter ainsi les problèmes liés au phénomène de ségrégation. La méthode consiste à former des particules de la composition métallique à utiliser pour les colonnes à partir d'une source liquide de la composition. Les particules solides sont ensuite formées en segments dont la composition est homogène en étirant des lingots de la composition pour obtenir un fil et en coupant le fil en segments.
Achard Louis-Marie
Blais Claude
Danovitch David
Garneau Jean-Francois
Robert Michel
Barrett B.p.
Ibm Canada Limited - Ibm Canada Limitee
LandOfFree
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